Ni-IDA resin

Ni-IDA resin

*This product has been discontinued!*
Ni-IDA resin
L00223I
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Description

none
Overview
Key Features Ni-IDA亲和层析介质的特性
球形基质4 %交联琼脂糖
平均粒径90 μm （45-165 μm）
动态吸附量20 mg 6×His 标签蛋白（27 kD）/ml介质
储存溶剂1× PBS（含20%乙醇）

Properties
Storage & Stability 2-8°C；DO NOT FREEZE